Printed circuit boards (PCBs), can be made with a variety of different materials, and there is always some debate as to which option is the best. In any type of application where there is a concern about operating the board under high temperature conditions, in applications where there is high pressure, high frequency or when there is a need for mission-critical levels of reliability, then a ceramic substrate is considered the best option.
The choice of a ceramic substrate creates a more durable board, largely due to the ability of the substrate to bond to the board. With complete bonding without any variations, it is easier to produce precision patterns on the surface of the board and also to ensure a longer life cycle for the board.
In specific types of applications, particularly when the board may be used in areas where moisture levels or humidity are a concern, this complete bonding of the substrate to the board surfaces also eliminates a concern of water damage to the board if it gets below the substrate surface and is trapped, allowing for damage and corrosion.
Cost of Production
When compared to an organic type of substrate, the choice of ceramic is an initial higher investment. As mentioned above, if the board is used in any type of harsh or adverse type of environment, such as in the military and defense sector, the telecommunication sector or in any type of outdoor to industrial application, the initial cost can be offset by a longer life cycle and decreased risk of board failure.
The qualities of the various ceramic substrate options allow the OEM to select the substrate with the specific qualities for the application. With the option for both low temperature and high-temperature manufacturing processes, these substrates are increasingly important in specialized as well as general PCB applications.
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